Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper in proceeding, 2006
Author
Suresh Chand Verma
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Subject Categories
Other Materials Engineering