Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper i proceeding, 2006
Författare
Suresh Chand Verma
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Ämneskategorier
Annan materialteknik