Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper i proceeding, 2006

Författare

Suresh Chand Verma

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Ämneskategorier

Annan materialteknik