Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Paper in proceeding, 2006
Author
Tomas Aronsson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong
Subject Categories (SSIF 2011)
Other Materials Engineering