Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Paper i proceeding, 2006

Författare

Tomas Aronsson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong

Ämneskategorier

Annan materialteknik

Mer information

Skapat

2017-10-07