New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper in proceeding, 2006
Author
Wen-xuan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong
Subject Categories (SSIF 2011)
Other Materials Engineering