New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper in proceeding, 2006
Author
Wen-xuan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 1114, 2006, Hong Kong
Subject Categories
Other Materials Engineering