New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper i proceeding, 2006

Författare

Wen-xuan Wang

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 11–14, 2006, Hong Kong

Ämneskategorier

Annan materialteknik

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Skapat

2017-10-07