New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper i proceeding, 2006
Författare
Wen-xuan Wang
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), December 1114, 2006, Hong Kong
Ämneskategorier
Annan materialteknik