Experimental Study of Component Placement in Solder Paste
Paper in proceeding, 2004
Author
Zoran Djurovic
Martin Dahlberg
Johan Anderson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
6th IEEE-CPMT Conference on High Density Microsystem Design and Packaging and Component Failure analysis
pp 185-194
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering