A 90-140 GHz, High Power Frequency Source Packaged in a Self-aligned Waveguide Module
Paper in proceedings, 2018

This paper presents a solution for packaging monolithic microwave integrated circuit (MMIC) using commercially available liquid crystal polymer (LCP) substrate print circuit board. This package solution comprises of a novel self-aligned microstrip-to-waveguide transition design. For demonstration, an active frequency multiplier-by three MMIC at F-band (90-140 GHz) is packaged into a split-block waveguide module and tested. The circuit is implemented in a 250-nm InP double-heterostructure bipolar transistor technology with ft/fmax 350/650 GHz, respectively. The tripler module has measured output power of 10.6 dBm and a 3-dB output bandwidth of 36.3%, (90-130 GHz). Total power consumption is 156 mW at 2-dBm input power.

F-band

multiplier

Microstrip-to-waveguide transition

E-plane probe

Author

Zhongxia Simon He

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Sona Carpenter

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Asia Pacific Microwave Conference-Proceedings

261-263

Asia-Pacific Microwave Conference (APMC)
Kyoto, Japan,

Lösningar för trådlös kommunikation med hög datatakt

Swedish Foundation for Strategic Research (SSF), 2014-03-01 -- 2019-06-30.

Subject Categories

Textile, Rubber and Polymeric Materials

Signal Processing

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.23919/APMC.2018.8617134

ISBN

9784902339451

More information

Latest update

8/20/2019