A 90-140 GHz, High Power Frequency Source Packaged in a Self-aligned Waveguide Module
Paper i proceeding, 2018

This paper presents a solution for packaging monolithic microwave integrated circuit (MMIC) using commercially available liquid crystal polymer (LCP) substrate print circuit board. This package solution comprises of a novel self-aligned microstrip-to-waveguide transition design. For demonstration, an active frequency multiplier-by three MMIC at F-band (90-140 GHz) is packaged into a split-block waveguide module and tested. The circuit is implemented in a 250-nm InP double-heterostructure bipolar transistor technology with ft/fmax 350/650 GHz, respectively. The tripler module has measured output power of 10.6 dBm and a 3-dB output bandwidth of 36.3%, (90-130 GHz). Total power consumption is 156 mW at 2-dBm input power.

F-band

multiplier

Microstrip-to-waveguide transition

E-plane probe

Författare

Zhongxia Simon He

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Sona Carpenter

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Vessen Vassilev

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Asia Pacific Microwave Conference-Proceedings

261-263

Asia-Pacific Microwave Conference (APMC)
Kyoto, Japan,

Lösningar för trådlös kommunikation med hög datatakt

Stiftelsen för Strategisk forskning (SSF), 2014-03-01 -- 2019-06-30.

Ämneskategorier

Textil-, gummi- och polymermaterial

Signalbehandling

Annan elektroteknik och elektronik

DOI

10.23919/APMC.2018.8617134

ISBN

9784902339451

Mer information

Senast uppdaterat

2019-08-20