A Terahertz-wave Double-Band Transition from Substrate Integrated Waveguide to Rectangular Waveguide for InP MMIC
Paper in proceeding, 2018
Integrated circuit packaging
THz circuits
Waveguide transitions
THz technologies
Rectangular waveguides
Author
Songyuan Yang
Beijing Institute of Technology
Weihua Yu
Beijing Institute of Technology
Xinxin Yang
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Xin Lv
Beijing Institute of Technology
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Zhongxia Simon He
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Proceedings of 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2018
140-141 8706119
Beijing, China,
Subject Categories
Other Physics Topics
Other Electrical Engineering, Electronic Engineering, Information Engineering
Condensed Matter Physics
DOI
10.1109/CICTA.2018.8706119