Flexible Low Profile Frequency Selective Surface for X-Band Shielding Applications
Paper in proceeding, 2019

This paper considers the design and evaluation of the performance of a low profile frequency selective surface (FSS) with flexible characteristics for X-band shielding applications. The proposed FSS unit cell is realized using a miniaturized ring loop (MRL) which is a transformed version of the conventional ring loop. The evaluation of the performance of the MRL for both planar and conformal configurations is performed using the Computer Simulation Technology (CST) software. First, the unit cell modelling is used to evaluate the performance of the planar MRL at various angles of incidence for both TE and TM polarizations. Second, the semi-infinite modelling technique is employed to evaluate the performance of the FSS in a curved configuration. Simulation results show that the proposed MRL was miniaturized to have a unit cell of 0.25λ0, where Ao is the free-space wavelength at the center frequency. The designed MRL demonstrates a stable transition response up to a 60° angle of incidence. In addition, it is worthwhile to note that when the proposed FSS is bent, the resonant frequency is slightly shifted by roughly 6%.

Flexible

EMI

Shielding

Frequency Selective Surface (FSS)

Author

Wai Yan Yong

University of Twente

Tom Hartman

University of Twente

Andres Alayon Glazunov

Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks

University of Twente

2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019

435-438 8893795

2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019
Sapporo, Japan,

Subject Categories

Aerospace Engineering

Other Engineering and Technologies not elsewhere specified

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.23919/EMCTokyo.2019.8893795

More information

Latest update

12/3/2019