Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration
Introductory text in journal, 2019

The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.

Author

Wonbin Hong

Pohang University of Science and Technology

Rob Maaskant

Chalmers, Electrical Engineering, Communication and Antenna Systems

Eindhoven University of Technology

Duixian Liu

IBM Research

Hua Wang

Georgia Institute of Technology

Atif Shamim

King Abdullah University of Science and Technology (KAUST)

Bart Smolders

Eindhoven University of Technology

Dirk Manteuffel

University of Hanover

Yueping Zhang

Nanyang Technological University

IEEE Antennas and Wireless Propagation Letters

1536-1225 (ISSN)

Vol. 18 11 2345-2350

Subject Categories

Telecommunications

Signal Processing

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/LAWP.2019.2945829

More information

Latest update

12/16/2019