Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration
Inledande text i tidskrift, 2019

The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.

Författare

Wonbin Hong

Pohang University of Science and Technology

Rob Maaskant

Chalmers, Elektroteknik, Kommunikations- och antennsystem

Technische Universiteit Eindhoven

Duixian Liu

IBM Research

Hua Wang

Georgia Institute of Technology

Atif Shamim

King Abdullah University of Science and Technology (KAUST)

Bart Smolders

Technische Universiteit Eindhoven

Dirk Manteuffel

Leibniz Universität Hannover

Yueping Zhang

Nanyang Technological University

IEEE Antennas and Wireless Propagation Letters

1536-1225 (ISSN)

Vol. 18 11 2345-2350

Ämneskategorier

Telekommunikation

Signalbehandling

Annan elektroteknik och elektronik

DOI

10.1109/LAWP.2019.2945829

Mer information

Senast uppdaterat

2019-12-16