Thermal modelling of a mutlichip IGBT power module
Paper in proceedings, 2019

Life time prediction and thermal management are among the key issues regarding the performance of today's semiconductor devices. And a fast and accurate thermal model can be used to tackle those problems more efficiently. In this paper, different thermal models of an IGBT power module have been established and compared. Firstly, a 3D finite element method (FEM) model is simulated in COMSOL. And then, a lumped parameter thermal model with considering different aspects (heat spreading and thermal coupling) is derived. The simulation indicates that the proposed model can achieve a relatively accurate result within a short simulation time.

IGBT

thermal modelling

Author

Chengjun Tang

Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics

Torbjörn Thiringer

Chalmers, Electrical Engineering, Electric Power Engineering, Electrical Machines and Power Electronics

21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
Ganua, Italy,

Increasing the value of Hydropower through increased Flexibility (HYDROFLEX)

European Commission, 2018-05-01 -- 2022-05-01.

Driving Forces

Sustainable development

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Energy

DOI

10.23919/EPE.2019.8914769

More information

Latest update

4/17/2020