Thermal modelling of a mutlichip IGBT power module
Paper i proceeding, 2019

Life time prediction and thermal management are among the key issues regarding the performance of today's semiconductor devices. And a fast and accurate thermal model can be used to tackle those problems more efficiently. In this paper, different thermal models of an IGBT power module have been established and compared. Firstly, a 3D finite element method (FEM) model is simulated in COMSOL. And then, a lumped parameter thermal model with considering different aspects (heat spreading and thermal coupling) is derived. The simulation indicates that the proposed model can achieve a relatively accurate result within a short simulation time.

IGBT

thermal modelling

Författare

Chengjun Tang

Chalmers, Elektroteknik, Elkraftteknik, Elmaskiner och kraftelektronik

Torbjörn Thiringer

Chalmers, Elektroteknik, Elkraftteknik, Elmaskiner och kraftelektronik

21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
Ganua, Italy,

Increasing the value of Hydropower through increased Flexibility (HYDROFLEX)

European Commission, 2018-05-01 -- 2022-05-01.

Drivkrafter

Hållbar utveckling

Ämneskategorier

Materialteknik

Elektroteknik och elektronik

Annan elektroteknik och elektronik

Styrkeområden

Energi

DOI

10.23919/EPE.2019.8914769

Mer information

Senast uppdaterat

2020-04-17