Enhanced Electrode Deposition for On-Chip Integrated Micro-Supercapacitors by Controlled Surface Roughening
Journal article, 2020

On-chip micro-supercapacitors (MSCs), integrated with energy harvesters, hold substantial promise for developing self-powered wireless sensor systems. However, MSCs have conventionally been manufactured through techniques incompatible with semiconductor fabrication technology, the most significant bottleneck being the electrode deposition technique. Utilization of spin-coating for electrode deposition has shown potential to deliver several complementary metal-oxide-semiconductor (CMOS)-compatible MSCs on a silicon substrate. Yet, their limited electrochemical performance and yield over the substrate have remained challenges obstructing their subsequent integration. We report a facile surface roughening technique for improving the wafer yield and the electrochemical performance of CMOS-compatible MSCs, specifically for reduced graphene oxide as an electrode material. A 4 nm iron layer is deposited and annealed on the wafer substrate to increase the roughness of the surface. In comparison to standard nonroughened MSCs, the increase in surface roughness leads to a 78% increased electrode thickness, 21% improvement in mass retention, 57% improvement in the uniformity of the spin-coated electrodes, and a high yield of 87% working devices on a 2″ silicon substrate. Furthermore, these improvements directly translate to higher capacitive performance with enhanced rate capability, energy, and power density. This technique brings us one step closer to fully integrable CMOS-compatible MSCs in self-powered systems for on-chip wireless sensor electronics. ©

Author

Agin Vyas

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

K. Wang

Alec Anderson

University of California

Andres Velasco

KU Leuven

Ruben Van Den Eeckhoudt

KU Leuven

Mohammad Mazharul Haque

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Qi Li

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Anderson David Smith

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Per Lundgren

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

ACS Omega

24701343 (eISSN)

Vol. In Press

Subject Categories

Inorganic Chemistry

Materials Chemistry

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1021/acsomega.9b04266

More information

Latest update

4/1/2020 1