D-band SiGe transceiver modules based on silicon-micromachined integration
Paper in proceedings, 2019

This paper reports on 130 GHz transceiver modules consisting of integrated multi-functional chipsets in a commercial 130nm SiGe BiCMOS process. The interconnect between the chipset and the package is non-galvanic and is realized in silicon micromachining technique. After successful fabrication and assembly, the individual Tx and Rx modules as well as the combined Tx-Rx link were tested using CW signals. Then realtime data transport over the link were carried out using different modulation formats and bandwidths. With 16QAM over a 750 MHz channel a 2.66 Gbit/s data rate was demonstrated with BER<10-11. These tests show that the D-band modules, obtained in a single implementation trial, work well functionally. The interconnect method is applicable to the full D-band and expected to also support frequencies in the sub-millimeter-wave range where traditional methods become challenging to apply.

SiGe hBT

D-band

Point-to-point links

Micromachining

Non-galvanic interconnect

Author

Y. Li

Ericsson

Mikael Hörberg

Ericsson

Klas Eriksson

Ericsson

James Campion

Royal Institute of Technology (KTH)

Ahmed Adel Hassona

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Sandro Vecchiattini

Ericsson

Torbjorn S. Dahl

Ericsson

Richard Lindman

Ericsson

M. Q. Bao

Ericsson

Zhongxia Simon He

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

F. Dielacher

Infineon Technologies

Joachim Oberhammer

Royal Institute of Technology (KTH)

Herbert Zirath

Ericsson

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Jonas Hansryd

Ericsson

Asia-Pacific Microwave Conference Proceedings, APMC

Vol. 2019-December 883-885 9038198

2019 IEEE Asia-Pacific Microwave Conference, APMC 2019
Singapore, Singapore,

Subject Categories

Computer Engineering

Signal Processing

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/APMC46564.2019.9038198

More information

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5/6/2020 1