Ahmed Adel Hassona

G-band Frequency Converters in 130-nm InP DHBT Technology

Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures

Packaging Technique of Highly Integrated Circuits Based on EBG Structure for +100 GHz Applications

A Compact PCB Gasket for Waveguide Leakage Suppression at 110-170 GHz

D-band waveguide-to-microstrip transition implemented in eWLB packaging technology

2020

Enabling Solutions for Integration and Interconnectivity in Millimeter-wave and Terahertz Systems

Nongalvanic Generic Packaging Solution Demonstrated in a Fully Integrated D-Band Receiver

Demonstration of +100-GHz Interconnects in eWLB Packaging Technology

A low-phase noise D-band signal source based on 130 nm SiGe BiCMOS and 0.15 mu m AlGaN/GaN HEMT technologies

A 140 GHz Transmitter with an Integrated Chip-to-Waveguide Transition using 130nm SiGe BiCMOS Process

F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

D-band SiGe transceiver modules based on silicon-micromachined integration

A D-band communication transmitter module with a novel self-aligned microstrip line-to-waveguide transition

A Low-loss D-band Chip-to-Waveguide Transition Using Unilateral Fin-line Structure

Spectrum Efficient D-band Communication Link for Real-time Multi-gigabit Wireless Transmission

2018

Non-galvanic Interconnects for Millimeter-wave Systems

Low-cost D-band Waveguide Transition on LCP Substrate

2017

A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology

D-band Waveguide Transition Based on Linearly Tapered Slot Antenna

Silicon Taper Based D-Band Chip to Waveguide Interconnect for Millimeter-Wave Systems