Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Journal article, 2021

This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the D-band (110-170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.

interconnect

Nails

Bandwidth

terahertz (THz)

millimeter waves (mmWs)

Periodic structures

D-band

Integrated circuit interconnections

Metamaterials

packaging

Wireless communication

Packaging

waveguide (wg) transition

Author

Ahmed Adel Hassona

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics, Microwave Electronics

Ashraf Uz Zaman

Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas

Victor Belitsky

Chalmers, Space, Earth and Environment, Onsala Space Observatory, GARD Technology

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 31 1 9-12

Subject Categories

Atom and Molecular Physics and Optics

Other Physics Topics

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/LMWC.2020.3034772

More information

Latest update

2/26/2021