Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Journal article, 2021
This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the D-band (110-170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.
D-band
Nails
Metamaterials
Wireless communication
waveguide (wg) transition
Packaging
packaging
terahertz (THz)
millimeter waves (mmWs)
interconnect
Integrated circuit interconnections
Bandwidth
Periodic structures
Author
Ahmed Adel Hassona
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Vessen Vassilev
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Ashraf Uz Zaman
Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks
Victor Belitsky
Chalmers, Space, Earth and Environment, Onsala Space Observatory
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
IEEE Microwave and Wireless Components Letters
1531-1309 (ISSN) 15581764 (eISSN)
Vol. 31 1 9-12 9256360Subject Categories
Atom and Molecular Physics and Optics
Other Physics Topics
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/LMWC.2020.3034772