Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Artikel i vetenskaplig tidskrift, 2021

This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the D-band (110-170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.

D-band

Nails

Metamaterials

Wireless communication

waveguide (wg) transition

Packaging

packaging

terahertz (THz)

millimeter waves (mmWs)

interconnect

Integrated circuit interconnections

Bandwidth

Periodic structures

Författare

Ahmed Adel Hassona

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Vessen Vassilev

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Ashraf Uz Zaman

Chalmers, Elektroteknik, Kommunikation, Antenner och Optiska Nätverk

Victor Belitsky

Chalmers, Rymd-, geo- och miljövetenskap, Onsala rymdobservatorium

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 31 1 9-12 9256360

Ämneskategorier

Atom- och molekylfysik och optik

Annan fysik

Annan elektroteknik och elektronik

DOI

10.1109/LMWC.2020.3034772

Mer information

Senast uppdaterat

2022-04-05