Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Artikel i vetenskaplig tidskrift, 2021
This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the D-band (110-170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.
D-band
Nails
Metamaterials
Wireless communication
waveguide (wg) transition
Packaging
packaging
terahertz (THz)
millimeter waves (mmWs)
interconnect
Integrated circuit interconnections
Bandwidth
Periodic structures
Författare
Ahmed Adel Hassona
Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik
Vessen Vassilev
Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik
Ashraf Uz Zaman
Chalmers, Elektroteknik, Kommunikation, Antenner och Optiska Nätverk
Victor Belitsky
Chalmers, Rymd-, geo- och miljövetenskap, Onsala rymdobservatorium
Herbert Zirath
Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik
IEEE Microwave and Wireless Components Letters
1531-1309 (ISSN) 15581764 (eISSN)
Vol. 31 1 9-12 9256360Ämneskategorier
Atom- och molekylfysik och optik
Annan fysik
Annan elektroteknik och elektronik
DOI
10.1109/LMWC.2020.3034772