A Low-loss D-band Chip-to-Waveguide Transition Using Unilateral Fin-line Structure
Paper in proceedings, 2018

This paper presents a D-band interconnect realized using unilateral finline structure. The interconnect consists of a microstrip line implemented on a 75μm-thick SiC substrate. The line then couples to a unilateral finline taper that is mounted in the E-plane of a standard WR-6.5 D-band waveguide. The interconnect achieves low insertion loss and covers very wide frequency range. The measured minimum insertion loss is 0.67 dB and the maximum is 2 dB per transition across the entire D-band covering the frequency range 110-170 GHz. The transition does not require any galvanic contacts nor any special processing and can be implemented in any of the commercially available semiconductor technologies. This solution provides low-loss wideband packaging technique that enables millimeter-wave systems assembly using a high-performance simple approach.

THz

waveguide transition

interconnects

D-band

millimeter waves

finline

Author

Ahmed Adel Hassona

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Other publications Research

Zhongxia Simon He

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Other publications Research

Omid Habibpour

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Other publications Research

Vincent Desmaris

Chalmers, Space, Earth and Environment, Onsala Space Observatory, GARD Technology

Other publications Research

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Other publications Research

Victor Belitsky

Chalmers, Space, Earth and Environment, Onsala Space Observatory, GARD Technology

Other publications Research

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Other publications Research

IEEE MTT-S International Microwave Symposium

0149-645x (ISSN)

Vol. 2018 390-393

IEEE/MTT-S International Microwave Symposium
Philadelphia, USA,

Subject Categories

Other Engineering and Technologies not elsewhere specified

Other Physics Topics

Other Electrical Engineering, Electronic Engineering, Information Engineering

Infrastructure

Onsala Space Observatory

DOI

10.1109/MWSYM.2018.8439643

Publication data connected to DOI

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Latest update

1/18/2019

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