Packaging Technique of Highly Integrated Circuits Based on EBG Structure for +100 GHz Applications
Paper in proceedings, 2020
waveguide transition
interconnect
D-band
packaging
Author
Ahmed Adel Hassona
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Vessen Vassilev
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics, Microwave Electronics
Ashraf Uz Zaman
Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
2020 14th European Conference on Antennas and Propagation (EuCAP)
9135289
Copenhagen, Denmark,
Subject Categories
Other Engineering and Technologies not elsewhere specified
Other Physics Topics
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.23919/EuCAP48036.2020.9135289