Performance of micro-grinding pins with different bonding while micro-grinding Si3N4
Journal article, 2020

Selection of a grinding tool with proper specification and bond material is a major challenge in the field of micro/grinding process. In this fundamental study, four different types of diamond micro-grinding pins were used. The bond types were varied and their effects on the grinding forces and surface roughness were analysed. In the experimental study, the microtopography of the grinding tool, cutting speed and depth of cut were considered as input process parameters as well as the bond. The results revealed that forces and surface roughness are highly influenced by the tool topography. Using vitrified micro-grinding pin resulted in lower grinding forces (up to 40%) than other types. The tool wear increased with the material removal when using metal bonded grinding tool. Nevertheless, vitrified grinding tool was exposed to the self-sharpening - lowering the forces. The hybrid bond tool was the most stable tool during the grinding process - keeping the forces and surface roughness almost in the same order over the time, despite higher induced cutting forces.

Tool microtopography

Grinding forces

Bond type

Surface quality

Micro-grinding

Si3N4

Tool specification

Author

Sergey Shamray

Furtwangen University (HFU)

Mohammadali Kadivar

Furtwangen University (HFU)

Chalmers, Industrial and Materials Science, Materials and manufacture

Amir Daneshi

Furtwangen University (HFU)

Bahman Azarhoushang

Furtwangen University (HFU)

International Journal of Abrasive Technology

1752-2641 (ISSN) 1752-265X (eISSN)

Vol. 10 1 16-31

Subject Categories

Tribology

Manufacturing, Surface and Joining Technology

Other Chemistry Topics

DOI

10.1504/IJAT.2020.109612

More information

Latest update

12/23/2020