Interdiffusion in cmsx-4 related ni-base alloy system at a supersolvus temperature
Journal article, 2021

Interdiffusion in Ni-base superalloy CMSX-4 and alloys related to CMSX-4 was investigated at the temperature 1288 °C, which is 8 °C above the y’-solvus temperature of this superalloy, 1280 °C. This temperature is of a special interest because it is a temperature of hot isostatic pressing applied to CMSX-4 and modeling of this process needs verified diffusion data for this specific temperature. Various diffusion couples were assembled from the investigated alloys, annealed at 1288 °C and studied by electron probe microanalysis. So far as the annealing temperature was higher than the y’-solvus temperature of CMSX-4 and other investigated alloys have no strengthening y’-phase, interdiffusion occurred in the fcc solid solutions of nickel. It was found that in the case when the y’-forming and y-stabilizing elements diffuse in the same direction (towards nickel) the diffusion rate accelerates, but when they diffuse in the opposite directions (counter diffusion) it slows down. Such an interdiffusion behavior is in agreement with the results predicted with diffusion simulation software Dictra.

Diffusion

Diffusion modeling

Nickel-base alloys

Electron probe microanalysis

Author

Alexander Epishin

Technische Universität Berlin

Anton Chyrkin

Chalmers, Chemistry and Chemical Engineering, Energy and Material

Bettina Camin

Technische Universität Berlin

Romain Saillard

University of Toulouse

Sophie Gouy

Paul Sabatier University

Bernard Viguier

University of Toulouse

Defect and Diffusion Forum

1012-0386 (ISSN) 1662-9507 (eISSN)

Vol. 407 1-10

Subject Categories

Other Materials Engineering

Metallurgy and Metallic Materials

Condensed Matter Physics

DOI

10.4028/www.scientific.net/DDF.407.1

More information

Latest update

3/26/2021