Terahertz Rectennas on Flexible Substrates Based on One-Dimensional Metal–Insulator–Graphene Diodes
Journal article, 2021
Flexible energy harvesting devices fabricated in scalable thin-film processes are crucial for wearable electronics and the Internet of Things. We present a flexible rectenna based on a one-dimensional junction metal–insulator–graphene diode, offering low-noise power detection at terahertz (THz) frequencies. The rectennas are fabricated on a flexible polyimide film in a scalable process by photolithography using graphene grown by chemical vapor deposition. A one-dimensional junction reduces the junction capacitance and enables operation up to 170 GHz. The rectenna shows a maximum responsivity of 80 V/W at 167 GHz in free space measurements and minimum noise equivalent power of 80 pW/√Hz.
terahertz
detector
graphene
Author
Andreas Hemmeter
RWTH Aachen University
Advanced Microelectronic Center Aachen (AMICA)
Xinxin Yang
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Zhenxing Wang
Advanced Microelectronic Center Aachen (AMICA)
Martin Otto
Advanced Microelectronic Center Aachen (AMICA)
Burkay Uzlu
RWTH Aachen University
Advanced Microelectronic Center Aachen (AMICA)
Marcel Andree
Bergische Universität Wuppertal
Ullrich Pfeiffer
Bergische Universität Wuppertal
Andrei Vorobiev
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Jan Stake
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Max Lemme
RWTH Aachen University
Advanced Microelectronic Center Aachen (AMICA)
Daniel Neumaier
Bergische Universität Wuppertal
Advanced Microelectronic Center Aachen (AMICA)
ACS Applied Electronic Materials
26376113 (eISSN)
Vol. 3 9 3747-3753Graphene Core Project 3 (Graphene Flagship)
European Commission (EC) (EC/H2020/881603), 2020-04-01 -- 2023-03-31.
Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1021/acsaelm.1c00134