A comparison of thermal stability in nanocrystalline Ni- and Co-based materials
Journal article, 2005

In this paper the microstructural development upon annealing of nanocrystalline Ni- and Co-based electrodeposits is described. New investigations on Ni, Ni - Fe, and Co-P are compared with previous results on Ni, Co, and Ni -P in terms of microstructural changes and stabilizing mechanisms. The conclusions are: pure nanocrystalline Ni and Co are stabilized by impurities in the grain boundaries. In the case of Co, also an allotropic phase transformation influences the occurrence of abnormal grain growth. Alloying and/or adding solutes is found to increase thermal stability. While in Ni-20 at.% Fe the ordering transformation is expected to be the reason for stabilization, in strongly segregating systems (Ni -P and Co-P) the stabilizing effect is the decrease in grain boundary energy due to solute segregation. After precipitation, Zener pinning still hinders grain boundary migration, but not sufficient to stabilize the nanocrystalline structure.

Thermal stability

Nanocrystalline materials

Transmission electron microscopy

Abnormal grain growth

In-situ annealing


Melina da Silva

Industrial and Materials Science

Uta Klement

Materials and manufacture

International Journal of Materials Research

1862-5282 (ISSN)

Vol. 96 9 1009-1014

Subject Categories


Metallurgy and Metallic Materials

Other Electrical Engineering, Electronic Engineering, Information Engineering



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