Thin-film flip-chip UVB LEDs realized by electrochemical etching
Other conference contribution, 2022

We will give an overview of different concepts to increase the light extraction efficiency (LEE) of ultraviolet (UV) light-emitting diodes (LEDs) with a focus on thin-film flip-chip (TFFC) devices. Optical simulations show that a TFFC design can greatly improve the LEE with a transparent p-side, reflective contacts, and optimized surface roughening. We will demonstrate UVB-emitting TFFC LEDs based on our fabrication platform for AlGaN thin films with high aluminum content. The fabrication is compatible with a standard LED process and uses substrate removal based on selective electrochemical etching as the key enabling technology.

led

thin-film

uvb

electrochemical etching

Author

Michael Alexander Bergmann

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Johannes Enslin

Technische Universität Berlin

Martin Guttmann

Technische Universität Berlin

Luca Sulmoni

Technische Universität Berlin

Neysha Lobo-Ploch

Ferdinand-Braun-Institut fur Hochstfrequenztechnik

Tim Kolbe

Ferdinand-Braun-Institut fur Hochstfrequenztechnik

Tim Wernicke

Technische Universität Berlin

Michael Kneissl

Technische Universität Berlin

Åsa Haglund

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

SPIE Photonics West Gallium nitride materials and devices XVII
San Fransisco, USA,

Areas of Advance

Nanoscience and Nanotechnology

Materials Science

Subject Categories

Physical Sciences

Other Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

Nano Technology

Infrastructure

Chalmers Materials Analysis Laboratory

Nanofabrication Laboratory

DOI

10.1117/12.2609581

More information

Latest update

10/26/2023