Substrate-Less Vertical Chip-to-Waveguide Transition for W-Band Array Antenna Integration
Paper in proceeding, 2023
This paper presents a vertical transition from a high permittivity GaAs MMIC to rectangular waveguide using bondwires as a coupling structure. The transition is advantageous for the direct integration of any off-the-shelf chip into a waveguide antenna since no modification of the GSG-pad or additional substrate is needed. An EBG structure consisting of pins is used for the packaging of the chip in order to avoid field propagation in undesired directions. The simulations results show that the reflection coefficient is lower than -10 dB and the average insertion loss is better than 0.5 dB from around 87 to 101 GHz (14% relative bandwidth).
waveguide (WG) transition
integration
bondwire
gap waveguide
mm-wave
Monolithic Microwave Integrated Circuit (MMIC)
packaging
W-band
GaAs
Author
Juan Luis Albadalejo Lijarcio
Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks
Abbas Vosoogh
Gapwaves AB
Vessen Vassilev
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Jian Yang
Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks
Thomas Emanuelsson
Ericsson
Ingmar Andersson
Ericsson
Ashraf Uz Zaman
Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks
2023 17TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, EUCAP
2164-3342 (ISSN)
978-88-31299-07-7 (ISBN)
17th European Conference on Antennas and Propagation (EuCAP)
Florence, Italy,
Florence, Italy,
Eureka CELTIC: Energy-Efficient Radio Systems at 100 GHz and beyond: Antennas, Transceivers and Waveforms
VINNOVA (2020-02889), 2021-01-01 -- 2024-02-07.
Subject Categories
Atom and Molecular Physics and Optics
Communication Systems
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.23919/EuCAP57121.2023.10133619