Design and Fabrication of All-metal Micromachined Finline Structures for Millimeter and Sub-millimeter Applications

Paper in proceeding, 2022

We present the design and fabrication of Allmetal
micromachined finline structures. These novel structures
have all the advantages of conventional finlines, i.e., large
fractional bandwidth and ease in the mounting process.
However, the absence of a dielectric substrate prevents the
excitation of substrate modes and the associated resonances,
hence the chip area is not limited by substrate size. All-metal
finlines could be integrated with existing finline-to-microstrip
transitions. This opens up new possibilities for the development
of planar circuitry in the millimeter and sub-millimeter range,
e.g., integrating this structure with an SIS mixer design.