Electroless deposition of nickel microbumps for fine-pith flip-chip bonding
Paper in proceeding, 2024

The reliability of micro-light-emitting diode (Micro-LED) is closely associated with the uniformity of microbumps arrays. With continual decreases in pixel pitch in recent years, it is a challenge to guarantee the uniformity of bump arrays. To satisfy current requirements for ultra-high-density interconnections, this study proposes an electroless plating method for fabricating highly uniform nickel microbumps. This technique differs from electroplating, in which the morphology and consistency of microbumps can be easily controlled. Furthermore, it is a high-selectivity and cost-effective method of microbumps fabrication that eliminates solder wastage and avoids metal lift-off in traditional evaporation. To minimize the non-uniformity of the bumps, we aim to optimize the oxygen plasma treatment parameters and deposition intervals to eliminate the issues of skip plating, hydrogen bubble entrapment, and nodules. Under the combined effect of plasma treatment and intermittent deposition method, microbump arrays with less than 5% uniformity were successfully prepared, achieving the demands of high-density bonding. In addition, the preparation process is highly reproducible, extending the application range of this technique.

Author

Yu Lu

Fuzhou University

Chang Lin

Fuzhou University

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China

Shuaishuai Wang

Fuzhou University

Kaixin Zhang

Fuzhou University

Taifu Lang

Fuzhou University

Yang Li

Fuzhou University

Qiwei Li

Fuzhou University

Tianxi Yang

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China

Zhonghang Huang

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China

Chunli Yan

Fuzhou University

Jie Sun

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics

Fuzhou University

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China

Qun Yan

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China

Fuzhou University

Journal of Physics: Conference Series

17426588 (ISSN) 17426596 (eISSN)

Vol. 2783 1 012022

2023 4th International Conference on Material Chemistry and Composite Materials, MCCM 2023
Sanya, China,

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1088/1742-6596/2783/1/012022

More information

Latest update

7/21/2024