Electroless deposition of nickel microbumps for fine-pith flip-chip bonding
Paper in proceeding, 2024
The reliability of micro-light-emitting diode (Micro-LED) is closely associated with the uniformity of microbumps arrays. With continual decreases in pixel pitch in recent years, it is a challenge to guarantee the uniformity of bump arrays. To satisfy current requirements for ultra-high-density interconnections, this study proposes an electroless plating method for fabricating highly uniform nickel microbumps. This technique differs from electroplating, in which the morphology and consistency of microbumps can be easily controlled. Furthermore, it is a high-selectivity and cost-effective method of microbumps fabrication that eliminates solder wastage and avoids metal lift-off in traditional evaporation. To minimize the non-uniformity of the bumps, we aim to optimize the oxygen plasma treatment parameters and deposition intervals to eliminate the issues of skip plating, hydrogen bubble entrapment, and nodules. Under the combined effect of plasma treatment and intermittent deposition method, microbump arrays with less than 5% uniformity were successfully prepared, achieving the demands of high-density bonding. In addition, the preparation process is highly reproducible, extending the application range of this technique.
Author
Yu Lu
Fuzhou University
Chang Lin
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Shuaishuai Wang
Fuzhou University
Kaixin Zhang
Fuzhou University
Taifu Lang
Fuzhou University
Yang Li
Fuzhou University
Qiwei Li
Fuzhou University
Tianxi Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Zhonghang Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Chunli Yan
Fuzhou University
Jie Sun
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Qun Yan
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
Journal of Physics: Conference Series
17426588 (ISSN) 17426596 (eISSN)
Vol. 2783 1 012022
2023 4th International Conference on Material Chemistry and Composite Materials, MCCM 2023
Sanya, China,
Sanya, China,
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1088/1742-6596/2783/1/012022