Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro-LEDs’ TFT Driver Substrates
Paper in proceeding, 2024
In this study, in order to achieve high-yield Micro-LED chip bonding and thus further advance the breakthrough of Micro- LED interconnect technology. In this study, an electroless plating method is used to achieve the highly uniform nickel bump arrays on thin film transistor (TFT) driver substrate. Initially, the photoresists AZ4620 and AZ2070 are chosen for the experiments, which can cover the step structure uniformly of TFT substrate. Subsequently, the morphology of bumps on the TFT substrate influenced by the plasma treatment and the deposition time is investigated. The 1% uniformity of the nickel bump arrays by the electroless plating for 30 minutes after 5-minute plasma treatment is achieved, which lays the foundation for the electroless plating self-bonding.
Highly Uniform
Micro-LED
Electroless Plating: Nickel Bump
Author
Shuaishuai Wang
Fuzhou University
Chang Lin
Fuzhou University
Yu Lu
Fuzhou University
Jie Sun
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
Fuzhou University
Qun Yan
Fuzhou University
Kaixin Zhang
Fuzhou University
Zhonghang Huang
Fuzhou University
Tianxi Yang
Fuzhou University
Tailiang Guo
Fuzhou University
Digest of Technical Papers - SID International Symposium
0097966X (ISSN) 21680159 (eISSN)
Vol. 55 S1 194-196
International Conference on Display Technology, 2024
Hefei, China,
Hefei, China,
Subject Categories
Metallurgy and Metallic Materials
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1002/sdtp.17035