Thin-Film Assisted Laser Transfer and Bonding (TFA-LTAB) for the Fabrication of Micro-LED Displays
Journal article, 2024
Micro-Light Emitting Diodes (Micro-LEDs) are key components in the field of next-generation display technologies. In the process of making Micro-LED displays, millions of chips need to be transferred to the driver substrate using mass transfer technology. Conventional transfer techniques, such as stamp transfer, present challenges in terms of processing efficiency and applicability due to the need for pre-prepared tethered structures and fixed chip pitch. To overcome these limitations, the t hin-film-assisted laser transfer and bonding (TFA-LTAB) technology is proposed. This technique is able to efficiently and accurately transfer Micro-LEDs from the source substrate to the driver substrate with arbitrary pitch through thin-film assistance, and electrically connects the chips through flip-chip bonding technology, which significantly improves the efficiency and reliability of the transfer and joining. The TFA-LTAB method proposed in this study integrates laser transfer and flip-chip bonding techniques. Through the TFA-LTAB process, these Micro-LEDs cultured on sapphire substrates are precisely assembled onto transparent low-temperature polycrystalline silicon thin-film transistors (LTPS-TFTs). The method successfully achieved mass transfer and bonding of Micro-LEDs with a size of 30 × 15 µm2 at low temperature (180 °C) and low pressure (0.08 MPa).
TFA-LTAB
transfer
micro-LED
bonding
Author
Taifu Lang
Fuzhou University
Xin Lin
Fuzhou University
Xiaowei Huang
Fuzhou University
Yujie Xie
Fuzhou University
Shuangjia Bai
Fuzhou University
Yijian Zhou
Fuzhou University
Shuaishuai Wang
Fuzhou University
Yu Lu
Fuzhou University
Xuehuang Tang
Fuzhou University
Chang Lin
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Zhonghang Huang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Kaixin Zhang
Fuzhou University
Qun Yan
Fuzhou University
Jie Sun
Fuzhou University
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
Advanced Electronic Materials
2199-160X (ISSN) 2199160x (eISSN)
Vol. In PressSubject Categories
Other Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1002/aelm.202400380