Flip-chip Integrated Superconducting Quantum Processors
Doctoral thesis, 2025
This thesis is a demonstration of the scalability of SQPs. By adopting 3-dimensional integration technologies used in semiconductor manufacturing, flip-chip integrated SQPs can host dozens to hundreds of qubits, compared to the smaller number of qubits a single-chip architecture can accommodate. The first part of this thesis shows how we transferred the design of individual components of the SQP—qubits, couplers, readout resonators, and Purcell filters—into a flip-chip architecture while maintaining good qubit coherence and high control-and-measurement performance with additional fabrication processes. We pay special attention to the interchip spacing, an additional design parameter introduced in the flip-chip architecture, which has a large influence on the parameter predictability and performance of the SQP.
The second part of the thesis shows how we used these individual components to design a scaled-up SQP. The design workflow of a multi-qubit SQP, from parameter design to layout, is elaborated in detail. This workflow has resulted in a 25-qubit flip-chip integrated SQP, without degrading the qubit coherence and gate performance, further demonstrating the scalability of flip-chip integrated SQPs. We speed up this design workflow by introducing an analytic design method for superconducting resonators based on conformal mapping techniques, which we use to design readout resonators with parameters that are not affected by variations of the interchip spacing.
design workflow
3D integration
simulation and design speed-up
flip-chip integration
quantum computing
superconducting quantum processor
Author
Hangxi Li
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Building blocks of a flip-chip integrated superconducting quantum processor
Quantum Science and Technology,;Vol. 7(2022)
Journal article
Qubit-compatible substrates with superconducting through-silicon vias
IEEE Transactions on Quantum Engineering,;Vol. 3(2022)
Journal article
Transmon qubit readout fidelity at the threshold for quantum error correction without a quantum-limited amplifier
npj Quantum Information,;Vol. 9(2023)
Journal article
Experimentally Verified, Fast Analytic, and Numerical Design of Superconducting Resonators in Flip-Chip Architectures
IEEE Transactions on Quantum Engineering,;Vol. 4(2023)
Journal article
To solve problems that are intractable by classical computers, the scale of quantum computers needs to be large enough, which equivalently means the number of 'qubit', the basic building block of the quantum computer, must grow into millions, while starting from only several we have currently on superconducting quantum processors, a kind of quantum computer we work with based on superconducting materials. In this thesis, we took our first step in this great challenge. By adopting 3-dimensional integration technologies that have been used by the semiconductor industry, we developed flip-chip integrated superconducting quantum processors that have better scalability to be able to host more than dozens of qubits, and demonstrated the feasibility of the technology with a 25-qubit superconducting quantum processor. Throughout the thesis, we discuss 3-dimensional integration technologies in general, new designs of processor components in the flip-chip architecture, and how we design a multi-qubit superconducting quantum processor with a design workflow. In addition, we also demonstrate a method to speed up this design workflow by shortening the simulation time of readout resonators, one of the critical components within the processor.
An Open Superconducting Quantum Computer (OpenSuperQ)
European Commission (EC) (EC/H2020/820363), 2018-10-01 -- 2021-09-30.
Open Superconducting Quantum Computers (OpenSuperQPlus)
European Commission (EC) (EC/HE/101113946), 2023-03-01 -- 2026-08-31.
Subject Categories
Other Computer and Information Science
Nano Technology
Other Electrical Engineering, Electronic Engineering, Information Engineering
Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Materials Science
Infrastructure
C3SE (Chalmers Centre for Computational Science and Engineering)
Nanofabrication Laboratory
ISBN
978-91-8103-153-9
Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 5611
Publisher
Chalmers
Kollektorn, MC2, Kemivägen 9, Chalmers University of Technology.
Opponent: Dr. Sebastian de Graaf, National Physical Laboratory, Teddington, UK