Flip-chip Integrated Superconducting Quantum Processors
Doctoral thesis, 2025

On the path toward fault-tolerant quantum computing—an endeavor motivated by the prospect of solving otherwise intractable computational problems in fields such as quantum chemistry, materials, and optimization—a key challenge is to scale up the number of quantum bits of information (qubits) a quantum computer can host while not degrading their performance. To this end, the superconducting quantum processor (SQP) has its advantages due to its flexible design, compatibility with microchip manufacturing processes, and addressability by microwaves generated by commercially available equipment.

This thesis is a demonstration of the scalability of SQPs. By adopting 3-dimensional integration technologies used in semiconductor manufacturing, flip-chip integrated SQPs can host dozens to hundreds of qubits, compared to the smaller number of qubits a single-chip architecture can accommodate. The first part of this thesis shows how we transferred the design of individual components of the SQP—qubits, couplers, readout resonators, and Purcell filters—into a flip-chip architecture while maintaining good qubit coherence and high control-and-measurement performance with additional fabrication processes. We pay special attention to the interchip spacing, an additional design parameter introduced in the flip-chip architecture, which has a large influence on the parameter predictability and performance of the SQP.

The second part of the thesis shows how we used these individual components to design a scaled-up SQP. The design workflow of a multi-qubit SQP, from parameter design to layout, is elaborated in detail. This workflow has resulted in a 25-qubit flip-chip integrated SQP, without degrading the qubit coherence and gate performance, further demonstrating the scalability of flip-chip integrated SQPs. We speed up this design workflow by introducing an analytic design method for superconducting resonators based on conformal mapping techniques, which we use to design readout resonators with parameters that are not affected by variations of the interchip spacing.

design workflow

3D integration

simulation and design speed-up

flip-chip integration

quantum computing

superconducting quantum processor

Kollektorn, MC2, Kemivägen 9, Chalmers University of Technology.
Opponent: Dr. Sebastian de Graaf, National Physical Laboratory, Teddington, UK

Author

Hangxi Li

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Building blocks of a flip-chip integrated superconducting quantum processor

Quantum Science and Technology,;Vol. 7(2022)

Journal article

Qubit-compatible substrates with superconducting through-silicon vias

IEEE Transactions on Quantum Engineering,;Vol. 3(2022)

Journal article

Signal Crosstalk in a Flip-Chip Quantum Processor

PRX Quantum,;Vol. 5(2024)

Journal article

After more than 100 years since the discovery of quantum physics, quantum technologies are starting to enter our daily lives. Among various quantum technologies, quantum computing, a new paradigm of computation, has excited people's expectations of solving problems that cannot be tackled by our current 'classical' computers. However, like every other new technology, quantum computers must go through their journey from infancy to maturity, from being trivial to being significant.

To solve problems that are intractable by classical computers, the scale of quantum computers needs to be large enough, which equivalently means the number of 'qubit', the basic building block of the quantum computer, must grow into millions, while starting from only several we have currently on superconducting quantum processors, a kind of quantum computer we work with based on superconducting materials. In this thesis, we took our first step in this great challenge. By adopting 3-dimensional integration technologies that have been used by the semiconductor industry, we developed flip-chip integrated superconducting quantum processors that have better scalability to be able to host more than dozens of qubits, and demonstrated the feasibility of the technology with a 25-qubit superconducting quantum processor. Throughout the thesis, we discuss 3-dimensional integration technologies in general, new designs of processor components in the flip-chip architecture, and how we design a multi-qubit superconducting quantum processor with a design workflow. In addition, we also demonstrate a method to speed up this design workflow by shortening the simulation time of readout resonators, one of the critical components within the processor.

An Open Superconducting Quantum Computer (OpenSuperQ)

European Commission (EC) (EC/H2020/820363), 2018-10-01 -- 2021-09-30.

Open Superconducting Quantum Computers (OpenSuperQPlus)

European Commission (EC) (EC/HE/101113946), 2023-03-01 -- 2026-08-31.

Subject Categories

Other Computer and Information Science

Nano Technology

Other Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Information and Communication Technology

Nanoscience and Nanotechnology

Materials Science

Infrastructure

C3SE (Chalmers Centre for Computational Science and Engineering)

Nanofabrication Laboratory

ISBN

978-91-8103-153-9

Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 5611

Publisher

Chalmers

Kollektorn, MC2, Kemivägen 9, Chalmers University of Technology.

Opponent: Dr. Sebastian de Graaf, National Physical Laboratory, Teddington, UK

More information

Latest update

12/18/2024