Cold sprayed Cu/Invar alloy composite
Journal article, 2025
Cold spray
Invar alloy
Thermal expansion coefficient
Thermal conductivity
Electronic packaging materials
Author
D. L. Ouyang
Nanchang Hangkong University
Z. R. Wang
Nanchang Hangkong University
Jiangxi Academy of Sciences
T. Yang
Nanchang Hangkong University
Jiangxi Academy of Sciences
L. W. Zhang
Jiangxi Academy of Sciences
D. Wu
Jiangxi Academy of Sciences
W. F. Chen
Jiangxi Academy of Sciences
Q. Hu
Jiangxi Academy of Sciences
Sheng Guo
Chalmers, Industrial and Materials Science, Materials and manufacture
Journal of Materials Research and Technology
22387854 (ISSN) 22140697 (eISSN)
Vol. 34 2673-2683Subject Categories (SSIF 2011)
Manufacturing, Surface and Joining Technology
Metallurgy and Metallic Materials
DOI
10.1016/j.jmrt.2024.12.270