Preparation of Bumps Using a Novel Photosensitive Conductive Polymer Material for Micro-LED Display Application
Paper in proceeding, 2024
Micro-light-emitting diode (Micro-LED) is increasingly favored due to their significant advantages in the performance of emerging augmented reality (AR) or virtual reality (VR) displays. A key process of single-chip integration technology in high-density micro displays is the interconnection process, which is closely related to the quality of display devices. The traditional chip interconnection is mainly achieved by preparing metal-based bump, which requires metal evaporation after photolithography, increases the process flow complexity, and poses a risk of photoresist peeling off. To solve these problems, we use a new type of photosensitive conductive polymer material to prepare bump that has conductivity and can directly interconnect chips vertically. Therefore, this method can eliminate the process of metal evaporation and reduce experimental risks. The results indicate that by optimizing the process parameters, bumps with high uniformity can be successfully prepared. This material can simplify the process flow and improve the success of subsequent vertical interconnection steps.
Micro-LED
Novel photosensitive conductive polymer
High uniformity
Bump
Author
Yifan Yang
Fuzhou University
Tianxi Yang
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xue Qi Zhu
Fuzhou University
Chang Lin
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Xiaowei Huang
Fuzhou University
Jie Sun
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics
Fuzhou University
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
C. L. Yan
Fuzhou University
Qun Yan
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China
Fuzhou University
2024 3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024
30-33
9798350390285 (ISBN)
3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024
Xi'an, China,
Xi'an, China,
Subject Categories (SSIF 2025)
Other Electrical Engineering, Electronic Engineering, Information Engineering
Textile, Rubber and Polymeric Materials
Other Materials Engineering
DOI
10.1109/ISSET62871.2024.10779742