Developments of Polymer Microwave Fiber Coupler in eWLB Package for Ultra-High-Speed Communication at D- and Y-Band
Paper in proceeding, 2026
Author
Maciej Wojnowski
Infineon Technologies
Ozan Yurduseven
Infineon Technologies
Simon Kornprobst
Infineon Technologies
Franz Xaver Engelsberger
Infineon Technologies
Walter Hartner
Infineon Technologies
Parisa Aghdam
Ericsson
Sining An
Ericsson
Frida Strömbeck
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
0569-5503 (ISSN) 2377-5726 (eISSN)
Orlando, USA,
European Core Technologies for Next Generation Communication-Computing Hardware
European Commission (EC) (EC/HE/101092598), 2023-01-01 -- 2025-12-31.
A Dual-frequency Distributed MIMO Approach for Future 6G Applications
European Commission (EC) (EC/HE/101096302), 2023-01-01 -- 2026-06-30.
Subject Categories (SSIF 2025)
Other Electrical Engineering, Electronic Engineering, Information Engineering