Developments of Polymer Microwave Fiber Coupler in eWLB Package for Ultra-High-Speed Communication at D- and Y-Band
Paper in proceeding, 2026

In this paper, we present developments of compact radio-frequency (RF) transitions from an integrated circuit (IC) to polymer microwave fiber (PMF) realized using embedded wafer level ball grid array (eWLB) package at the D- (110–170 GHz) and Y-bands (170–260 GHz). The proposed solution employs a Vivaldi antenna-in-package (AiP) for differential IC interfaces. For single-ended interfaces, a novel inverted Vivaldi antenna is introduced for the first time. The developed PMF couplers exhibit an insertion loss of only 2.5 dB at 140 GHz and 4.5 dB at 240 GHz, opening a path toward the realization of low-cost, high-throughput PMF communication systems.

Author

Maciej Wojnowski

Infineon Technologies

Ozan Yurduseven

Infineon Technologies

Simon Kornprobst

Infineon Technologies

Franz Xaver Engelsberger

Infineon Technologies

Walter Hartner

Infineon Technologies

Parisa Aghdam

Ericsson

Sining An

Ericsson

Frida Strömbeck

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

2026 IEEE 76th Electronic Components and Technology Conference (ECTC)

0569-5503 (ISSN) 2377-5726 (eISSN)

2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Orlando, USA,

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Subject Categories (SSIF 2025)

Other Electrical Engineering, Electronic Engineering, Information Engineering

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Created

6/18/2026