A Polymer Microwave Fiber Link at Y-band for Low-Cost High-Speed Communication
Paper in proceeding, 2026

This paper presents a Y-band (170–260 GHz) Polymer Microwave Fiber (PMF) communication link designed for high data-rate, low-cost short-range interconnects. The transmitter and receiver are implemented in a commercial 90–nm SiGe BiCMOS process and packaged using embedded Wafer-Level Ball Grid Array (eWLB) technology featuring an in-package Vivaldi antenna for PMF launching. Link measurements at 234 GHz demonstrate reliable data transmission up to 60 Gbps over a 30cm PMF using QPSK modulation, achieving BER values below 10−3. The results show that silicon-based transceivers combined with eWLB packaging can deliver high-performance PMF links above 200 GHz, offering a scalable and cost-effective solution for future high-throughput data-center interconnects.

Y-band

PMF

SiGe BiCMOS

eWLB

Author

Frida Strömbeck

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Maciej Wojnowski

Infineon Technologies

Klaus Standner

Infineon Technologies

Walter Hartner

Infineon Technologies

Yu Yan

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

2026 56th European Microwave Conference (EuMC)


979-8-3315-6276-2 (ISBN)

2026 56th European Microwave Conference (EuMC)
London, United Kingdom,

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Subject Categories (SSIF 2025)

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.23919/EuMC69230.2026.11748346

More information

Created

11/3/2026