A Polymer Microwave Fiber Link at Y-band for Low-Cost High-Speed Communication
Paper i proceeding, 2026

This paper presents a Y-band (170–260 GHz) Polymer Microwave Fiber (PMF) communication link designed for high data-rate, low-cost short-range interconnects. The transmitter and receiver are implemented in a commercial 90–nm SiGe BiCMOS process and packaged using embedded Wafer-Level Ball Grid Array (eWLB) technology featuring an in-package Vivaldi antenna for PMF launching. Link measurements at 234 GHz demonstrate reliable data transmission up to 60 Gbps over a 30cm PMF using QPSK modulation, achieving BER values below 10−3. The results show that silicon-based transceivers combined with eWLB packaging can deliver high-performance PMF links above 200 GHz, offering a scalable and cost-effective solution for future high-throughput data-center interconnects.

Y-band

PMF

SiGe BiCMOS

eWLB

Författare

Frida Strömbeck

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Maciej Wojnowski

Infineon Technologies

Klaus Standner

Infineon Technologies

Walter Hartner

Infineon Technologies

Yu Yan

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

2026 56th European Microwave Conference (EuMC)


979-8-3315-6276-2 (ISBN)

2026 56th European Microwave Conference (EuMC)
London, United Kingdom,

Towards Energy-Efficient Tbps Wireless Links (TeraGreen)

Europeiska kommissionen (EU) (EC/HC/101139117), 2024-01-01 -- 2028-06-30.

European Core Technologies for Next Generation Communication-Computing Hardware

Europeiska kommissionen (EU) (EC/HE/101092598), 2023-01-01 -- 2025-12-31.

Ämneskategorier (SSIF 2025)

Annan elektroteknik och elektronik

DOI

10.23919/EuMC69230.2026.11748346

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2026-11-03