60 GHz broadband 0=1-level RF-via interconnect for RF-MEMS packaging
Journal article, 2007

The RF-via interconnect structure from the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0=1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package

RF via interconnect


W.C. Wu

L. H. Hsu

E. Y. Chang

Piotr Starski

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2)

Electronics Letters

Vol. 43 22, Oct. 25

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information