60 GHz broadband 0=1-level RF-via interconnect for RF-MEMS packaging
Artikel i vetenskaplig tidskrift, 2007

The RF-via interconnect structure from the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0=1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package

RF via interconnect

Författare

W.C. Wu

L. H. Hsu

E. Y. Chang

Piotr Starski

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Electronics Letters

Vol. 43

Ämneskategorier

Annan elektroteknik och elektronik