Flip chip assembly of a commersial MMIC amplifier on thin film alumina with electroplated pillars
Other conference contribution, 2005
Author
Camilla Kärnfelt
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Christina Tegnander
Piotr Starski
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Janusz Rudnicki
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Anders Emrich
Proceedings of GigaHertz 2005
Vol. 1 1 234-237
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering