Reliability of Conductive adhesives
Journal article, 2005

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zhimin Mo

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Lead-Free Solder Interconnect Reliability

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Latest update

12/13/2018