Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Paper in proceeding, 2016
Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.
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CROSTRUCTURE AND PROCESSING3rd International Conference on Materials for Advanced
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Author
Josef Hansson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Carl Zandén
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano)
371-374
978-1-5090-1493-4 (ISBN)
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
Nano Technology
DOI
10.1109/NANO.2016.7751383
ISBN
978-1-5090-1493-4