Terahertz components packaging using integrated waveguide technology
Paper in proceedings, 2011

We present an integrated waveguide based packaging solution compatible with different THz component technologies, both for room temperature and cryogenic operations, employing space-qualified wire-bonding for electrical contacts. The proposed waveguide packaging relies on the combination of all-metal micro-machined THz waveguide and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. It provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while a 2 μm alignment accuracy of the active component chip was verified. © 2011 IEEE.

Submillimeter wave technology

Submillimeter wave devices

Integrated circuits packaging

Packaging

Author

Vincent Desmaris

Chalmers, Earth and Space Sciences, Advanced Receiver Development

Denis Meledin

Chalmers, Earth and Space Sciences, Advanced Receiver Development

Dimitar Milkov Dochev

Chalmers, Earth and Space Sciences, Advanced Receiver Development

Alexey Pavolotskiy

Chalmers, Earth and Space Sciences, Advanced Receiver Development

Victor Belitsky

Chalmers, Earth and Space Sciences, Advanced Receiver Development

2011 IEEE MTT-S International Microwave Workshop on Millimeter Wave Integration Technologies, IMWS 2011, Sitges 15 September 2011 through 16 September 2011

81-84 6061893

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/IMWS3.2011.6061893

ISBN

978-161284965-2

More information

Created

10/6/2017