Low temperature full wafer adhesive bonding of structured wafers
Journal article, 2001

Author

Frank Niklaus

Helene Andersson

Peter Enoksson

Department of Microelectronics

Göran Stemme

Sensors and Actuators A

Vol. 92 235-241

Areas of Advance

Nanoscience and Nanotechnology

Production

Materials Science

Subject Categories

Materials Engineering

Other Engineering and Technologies

Other Engineering and Technologies not elsewhere specified

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017