Low temperature full wafer adhesive bonding of structured wafers
Paper in proceeding, 2000
Author
Frank Niklaus
Helene Andersson
Peter Enoksson
Department of Microelectronics
Göran Stemme
EUROSENSORS XIV, Copenhagen, Denmark, Aug. 27-30
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Production
Materials Science
Subject Categories
Materials Engineering
Other Engineering and Technologies
Electrical Engineering, Electronic Engineering, Information Engineering