Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted wafer bonding

Anke Sanz-Velasco; Henrik Rödjegård; Gert Andersson

Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted wafer bonding
Journal article, 2002

Author

Anke Sanz-Velasco

Department of Microelectronics

Other publications Research

Henrik Rödjegård

Gert Andersson

Journal of Micromechanics and Microengineering

Vol. v12 n6 786-7-94-

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/8/2017

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Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted wafer bonding Journal article, 2002