ZrO2 and ZrO2/Y2O3 gate dielectrics prepared by evaporation and annealing processes
Paper in proceedings, 2002

The electrical characteristics of MOS capacitors with ZrO2 gate dielectric prepared by e-beam evaporation of Zr or Yttrium Stabilized Zirconia (YSZ) and subsequent thermal treatment are reported. With this method dielectrics corresponding to an equivalent oxide thickness (EOT) of 1.9 nm and a relative dielectric constant of approximately 15 have been prepared. The effect of annealing on Zr incorporation into the Si substrate is investigated SIMS analysis showed no signs of Zr diffusion in the substrate at temperatures as high as 900°C and that significant diffusion from the dielectric layer occur only at 1100°C

mass spectroscopic chemical analysis

secondary ion mass spectra

electron beam deposition

yttrium compounds

MOS capacitors

zirconium compounds

annealing

permittivity

diffusion

Author

Mikael Johansson

Department of Microelectronics

M. Y. A. Yousif

Department of Microelectronics

Alok Sareen

Department of Microelectronics

Per Lundgren

Department of Microelectronics

Stefan Bengtsson

Department of Microelectronics

Ulf Södervall

Department of Physics

ASDAM '02. Conference Proceedings. Fourth International Conference on Advanced Semiconductor Devices and Microsystems

279-

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/ASDAM.2002.1088524

More information

Created

10/7/2017