High frequency properties of electrically conductive adhesive interconnections and multilayer substrates
Licentiate thesis, 1998
microwaves
sequential build-up board
electrically conductive adhesives
flip-chip
printed cirquit board
anisotropic adhesives
multilayer
interconnections
printed wire board
surface mount technology
isotopic adhesives
Author
Markus Dernevik
Department of Microelectronics
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
992-576032-1
Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 276