High frequency properties of electrically conductive adhesive interconnections and multilayer substrates
Licentiatavhandling, 1998
microwaves
sequential build-up board
electrically conductive adhesives
flip-chip
printed cirquit board
anisotropic adhesives
multilayer
interconnections
printed wire board
surface mount technology
isotopic adhesives
Författare
Markus Dernevik
Institutionen för mikroelektronik
Ämneskategorier
Elektroteknik och elektronik
ISBN
992-576032-1
Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 276